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Topics |
Co-Chairs |
| E1 |
Processes » Assembly and Integration - 8 — Tze-Ching Yang, Li-De Wang , Ming-Hsieng Lu and Meng-Hsiu Tsai, "Projection Bonding of the TO-type Optical Device with Micro-resistance Welding," Metal Industries R & D Centre.
- 12 — Taeho Ha, Junyeob Song, Changwoo Lee, "Development of Micro-assembly System for Camera Phone Lens Module," Korea Institute of Machinery and Materials.
- 38 — Chang-Sheng Lin,Yunn-Shiuan Liao, Shun-Tong Chen, "Micro Screw Pin Assembly and On-The-Machine Assembly Technologies," National Taiwan University.
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Dornfield |
| E2 |
Processes » Semi-solid forming II - 49 — Vijay Shilpiekandula, Daniel J. Burns, Kamal Youcef-Toumi, "A Review of Metrology of Microembossed Microfluidic Devices," MIT.
- 57 — David Hardt and Wang Qi, "Processing Window Identification and Process Variability Study of Micro Embossing," MIT.
- 58 — David Hardt and Kunal Thaker, "A Functional Testing System for Process Characterization and Optimization of a Hot Micro-Embossing Machine," MIT.
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Mayor |
| E3 |
Transducers » Piezo-based - 17 — Byeong Hee Kim, Jong Pil Choi, Kwon Sun Nam, and Nak Kyu Lee, "Development of High Precision Actuator System by the Inchworm Mechanism," Kangwon National University, Korea.
- 63 — Bintang Yang and Marc Bonis, "Approach of optimum design of a magnetostrictive inchworm mini-actuator," Université de Technologie de Compiègne, Compiègne.
- 68 — Choi, H. and Han, C., "Development of Piezoelectric Rotary Actuator for Microfactory," Hanyang University.
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Vallance |
| Back to the Full Program |
